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含苯并噁唑环氧树脂的合成、固化动力学及热性能
(1.上海华谊树脂有限公司;2.特种功能高分子材料及相关技术教育部重点实验室)
Synthesis, Curing Kinetics and Thermal Stability of Epoxy Resin Containing Benzoxazole Ring
(1.Shanghai Huayi Resins Co,Ltd Shanghai;2.Key Laboratory of Special Functional Polymer Materials and Related Technology of the Ministry of Education, School of Materials Science and Engineering)
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投稿时间:2018-06-16    修订日期:2018-09-13
中文摘要: 通过两步法制备了两种含苯并噁唑结构的环氧树脂DAROH-O与HOH-O,采用红外光谱和核磁共振波谱分析对树脂的结构进行了表征。结果表明,在使用DDM为固化剂的情况下,对DAROH-O/DDM体系来说,采用Kissinger法计算得到的表观反应活化能为176.92KJ/mol,采用Ozawa法计算得到反应活化能175.36KJ/mol。对HOH-O/DDM体系来说,采用Kissinger法计算得到的表观反应活化能为198.45KJ/mol,采用Ozawa法计算得到的表观反应活化能为196.15KJ/mol。热重分析表明这两种环氧树脂固化物的耐热性均要远高于普通双酚A环氧树脂/DDM固化物。固化物的失重过程包括两个阶段,第一阶段的分解出现在350℃-370℃左右,第二阶段的分解发生在600℃左右,属于苯并噁唑环的分解。
Abstract:In this work, two kinds of epoxy resin, DAROH-O and HOH-O, which contain benzoxazole ring, were prepared. Fourier Transform infrared spectroscopy (FTIR) and Nuclear Magnetic Resonance (NMR) analysis confirmed that the structure of the synthesized product was consistent with the expected structure. Differential scanning calorimeter (DSC) studies show that the apparent activation energy of the curing reaction by Kissinger method is 176.92 KJ/mol and is 175.36 KJ/mol by the Ozawa method for the DAROH-O/DDM system. For the HOH-O/DDM system, the apparent activation energy obtained is 198.45 KJ/mol and 196.15 KJ/mol, by Kissinger method and Ozawa method, respectively. The thermogravimetric analysis (TGA) shows that the thermostability of two epoxy resins were almost the same. The weight loss process includes two stages: the first weight loss occurs at about 350-370℃, and the second weight loss occurs at about 600℃, which belongs to the decomposition of the benzoxazole ring.
文章编号:20180616001     中图分类号:TB35    文献标志码:
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作者单位地址
黄慧琳 上海华谊树脂有限公司 上海市闵行区龙吴路4600号
周云超 特种功能高分子材料及相关技术教育部重点实验室 
刘小云* 特种功能高分子材料及相关技术教育部重点实验室 上海市徐汇区梅陇路130号 华东理工大学材料学院
引用本文:
黄慧琳,周云超,刘小云.含苯并噁唑环氧树脂的合成、固化动力学及热性能[J].功能高分子学报,DOI:10.14133/j.cnki.1008-9357.20180616001.
HUANG Huilin,ZHOU Yunchao,LIU Xiaoyun.Synthesis, Curing Kinetics and Thermal Stability of Epoxy Resin Containing Benzoxazole Ring[J].Journal of Functional Polymers,DOI:10.14133/j.cnki.1008-9357.20180616001.